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CP317X-2N918

15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Amplifier Power Gain (Gpe)
15 dB
Base-Emitter Saturation Voltage (VBE(SAT))
1 V
Collector Efficiency (η)
25 %
Collector-Base Breakdown Voltage (BVCBO)
30 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Cutoff Current (ICBO)
1 µA
Collector-Base Voltage (VCBO)
30 V
Collector-Emitter Breakdown Voltage (BVCEO)
15 V
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Voltage (VCEO)
15 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
600 MHz
DC Current Gain (hFE)
20
Emitter-Base Breakdown Voltage (BVEBO)
3 V
Emitter-Base Voltage (VEBO)
3 V
Input Capacitance (Cib)
2 pF
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
6 dB
Output Capacitance (Cob)
1.7 pF
Output Capacitance (Cob)
3 pF
Power Dissipation (PD)
200 mW
Power Dissipation (PD)
300 mW
Power Output (Pout)
30 mW
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient (ΘJA)
875 °C/W
Thermal Resistance Junction-Case (ΘJC)
583 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP317X-2N918-CM WafflePack@400 Active 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP317X-2N918-CT WafflePack@400 Active 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP317X-2N918-CT20 WafflePack@20 Special Order Item 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP317X-2N918-WN Wafer Active 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP317X-2N918_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Small Signal Transistor Process Change Notice
Process Change Notice:CMPT5179 / CMPT918 / CEN1056A Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPT918 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

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