CP325V-MJE181

60V,3A,1.5W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A)

Case Type: WAFER

Base-Emitter On Voltage (VBE(ON))
1.2 V
Base-Emitter Saturation Voltage (VBE(SAT))
1.5 V
Base-Emitter Saturation Voltage (VBE(SAT))
2 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Cutoff Current (ICBO)
100 µA
Collector-Base Voltage (VCBO)
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
60 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
900 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
1.7 V
Collector-Emitter Voltage (VCEO)
60 V
Continuous Base Current (IB)
1 A
Continuous Collector Current (IC)
3 A
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
50 — 250
DC Current Gain (hFE)
30
DC Current Gain (hFE)
12
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
7 V
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
30 pF
Peak Collector Current (ICM)
6 A
Power Dissipation (PD)
1.5 W
Power Dissipation (PD)
15 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
83 °C/W
Thermal Resistance Junction-Case (ΘJC)
8.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP325V-MJE181-WN Wafer Active 60V,3A,1.5W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CP325V.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Process Change Notice:Wafer Diameter Change from 4" Process Change Notice
Spice Model:Spice Model CP325 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development