CP388X-2N5088
30V,50mA,625mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 mA
VCE = 5 V
Test Conditions
IC = 100 µA
Test Conditions
VCB = 20 V
Test Conditions
IC = 1 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
VCE = 5 V
IC = 500 µA
f = 20 MHz
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VEB = 3 V
Test Conditions
VEB = 4.5 V
Test Conditions
VEB = 0.5 V
f = 100 kHz
Test Conditions
VCE = 5 V
IC = 100 µA
f = 15.7 kHz
RS = 10 kΩ
Test Conditions
VCB = 5 V
f = 100 kHz
Test Conditions
VCE = 5 V
IC = 1 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP388X-2N5088-CT | WafflePack@400 | Active | 30V,50mA,625mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
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| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| CP388X-2N5088_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N5088 | Spice Model |