CP388X-2N5089

25V,50mA,625mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

Base-Emitter On Voltage (VBE(ON))
800 mV
Collector-Base Breakdown Voltage (BVCBO)
30 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
30 V
Collector-Emitter Breakdown Voltage (BVCEO)
25 V
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Voltage (VCEO)
25 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
400 — 1200
DC Current Gain (hFE)
450
DC Current Gain (hFE)
400
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
4.5 V
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
2 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
625 mW
Small Signal Current Gain (hfe)
450 — 1800
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
83.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP388X-2N5089-CT WafflePack@400 Active 25V,50mA,625mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP388X-2N5089_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Small Signal Transistor Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPT5089 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object