CP388X-BC108
25V,200mA,600mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 2 mA
VCE = 5 V
Test Conditions
IC = 10 mA
VCE = 5 V
Test Conditions
IC = 10 mA
IB = 0.5 mA
(700 mV Typical)
Test Conditions
IC = 100 mA
IB = 5 mA
(1 V Typical)
Test Conditions
VCB = 25 V
Test Conditions
VCB = 25 V
TA = 125 °C
Test Conditions
IC = 2 mA
Test Conditions
IC = 10 mA
IB = 0.5 mA
Test Conditions
IC = 100 mA
IB = 5 mA
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 2 mA
Test Conditions
IE = 10 µA
Test Conditions
VCE = 5 V
IC = 0.2 mA
BW = 200 Hz
f = 1 kHz
RG = 2 Ω
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP388X-BC108-CT | WafflePack@400 | Active | 25V,200mA,600mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP388X-BC108-WN | Wafer | Active | 25V,200mA,600mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| CP388X-BC108_WPD.PDF | Device Datasheet |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |
Product Support
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Design Support
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- Special wafer diffusions
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- Package details
- Application notes
- Application and design sample kits
- Custom product and package development