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CP392V-CMPT3904

40V,200mA,350mW Bare die,11.024 X 11.024 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Base Cutoff Current (IBL)
50 nA
Base-Emitter Saturation Voltage (VBE(SAT))
650 — 850 mV
Base-Emitter Saturation Voltage (VBE(SAT))
950 mV
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Voltage (VCBO)
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Cutoff Current (ICEV)
50 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCEO)
40 V
Continuous Collector Current (IC)
200 mA
Current Gain-Bandwidth Product (fT)
300 MHz
DC Current Gain (hFE)
40
DC Current Gain (hFE)
70
DC Current Gain (hFE)
100 — 350
DC Current Gain (hFE)
60
DC Current Gain (hFE)
30
Delay Time (td)
35 ns
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Voltage (VEBO)
6 V
Fall Time (tf)
80 ns
Input Capacitance (Cib)
12 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
350 mW
Rise Time (tr)
35 ns
Storage Temperature (Tstg)
-65 — 150 °C
Storage Time (ts)
170 ns
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP392V-CMPT3904-CM WafflePack@400 Active 40V,200mA,350mW Bare die,11.024 X 11.024 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP392V-CMPT3904-CT WafflePack@400 Active 40V,200mA,350mW Bare die,11.024 X 11.024 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP392V-CMPT3904_WPD.PDF Device Datasheet
Material Composition:SOT-223 Material Composition
Package Detail Document:SOT-223 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-223 Process Change Notice
Process Change Notice:CP192V/CP592V DIE SHRINK Process Change Notice
Product EOL Notice:All devices in SOT-223 Case Product EOL Notice
Product Reliability Data:SOT-223 Package Reliability Product Reliability Data
Spice Model:Spice Model CZT3904 Spice Model
Step File 3D Object:SOT-223 Step File 3D Object