CP591X-H2N2907A-CM
60V,600mA,400mW Bare die,19.290 X 19.290 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 50 V
Test Conditions
VCB = 50 V
TA = 150 °C
Test Conditions
IC = 10 mA
Test Conditions
VCE = 30 V
VBE(OFF) = 0.5 V
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
VCE = 20 V
IC = 50 mA
f = 100 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
Test Conditions
VCE = 10 V
IC = 1 mA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 2 V
f = 1 MHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCC = 6 V
IC = 150 mA
IB1 = 15 mA
IB2 = 15 mA
Test Conditions
VCC = 30 V
IC = 150 mA
IB1 = 15 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP591X-H2N2907A-CM | WafflePack@400 | Active | 60V,600mA,400mW Up-Screened Bare Die MIL-PRF-38534 Class H Equivalent,19.290 X 19.290 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP591X-2N2907A_WPD.PDF | Device Datasheet |
| Material Composition:SOT-223 | Material Composition |
| Package Detail Document:SOT-223 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
| Product EOL Notice:All devices in SOT-223 Case | Product EOL Notice |
| Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CZT2907A | Spice Model |
| Step File 3D Object:SOT-223 | Step File 3D Object |