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CP704V-CMPTA56
80V,500mA,350mW Bare die,22.000 X 22.000 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 1 V
Test Conditions
VCB = 80 V
Test Conditions
VCB = 80 V
TA = 150 °C
Test Conditions
IC = 1 mA
Test Conditions
VCE = 60 V
Test Conditions
IC = 100 mA
IB = 10 mA
Test Conditions
VCE = 1 V
IC = 100 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 10 mA
Test Conditions
VCE = 1 V
IC = 100 mA
Test Conditions
IE = 100 µA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP704V-CMPTA56-CT | WafflePack@400 | Active | 80V,500mA,350mW Bare die,22.000 X 22.000 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| Analytical Test Report:Wafer/Die | Analytical Test Report |
| CP704V-CMPTA56_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |