CP705V-BC327-25
45V,500mA,625mW Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 500 mA
VCE = 1 V
Test Conditions
VCB = 20 V
Test Conditions
VCB = 20 V
TA = 150 °C
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 100 mA
Test Conditions
VCE = 1 V
IC = 500 mA
Test Conditions
VEB = 5 V
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP705V-BC327-25-CT | WafflePack@400 | Active | 45V,500mA,625mW Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
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| CP705V_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
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| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |