CP705V-HCZT4033-CM

80V,1A,2W Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

Base-Emitter Saturation Voltage (VBE(SAT))
900 mV
Base-Emitter Saturation Voltage (VBE(SAT))
1.1 V
Collector-Base Breakdown Voltage (BVCBO)
80 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
80 V
Collector-Emitter Saturation Voltage (VCE(SAT))
150 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Voltage (VCEO)
80 V
Continuous Collector Current (IC)
1 A
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
75
DC Current Gain (hFE)
100 — 300
DC Current Gain (hFE)
70
DC Current Gain (hFE)
25
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage (VEBO)
5 V
Input Capacitance (Cib)
110 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
20 pF
Peak Collector Current (ICM)
1.5 A
Power Dissipation (PD)
2 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
62.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP705V-HCZT4033-CM WafflePack@400 Active 80V,1A,2W Up-Screened Bare Die MIL-PRF-38534 Class H Equivalent,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Cap Analytical Test Report
Analytical Test Report:Header Analytical Test Report
Analytical Test Report:Header Assembly Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
CP705V_WPD.PDF Device Datasheet
Material Composition:TO-39 Material Composition
Package Detail Document:TO-39 Package Detail Document
Product Reliability Data:TO-39 Package Reliability Product Reliability Data
Spice Model:Spice Model 2N4033 Spice Model