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CP705V-CZT4033

80V,1A,2W Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Base-Emitter Saturation Voltage (VBE(SAT))
900 mV
Base-Emitter Saturation Voltage (VBE(SAT))
1.1 V
Collector-Base Breakdown Voltage (BVCBO)
80 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
80 V
Collector-Emitter Saturation Voltage (VCE(SAT))
150 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Voltage (VCEO)
80 V
Continuous Collector Current (IC)
1 A
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
75
DC Current Gain (hFE)
100 — 300
DC Current Gain (hFE)
70
DC Current Gain (hFE)
25
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage (VEBO)
5 V
Input Capacitance (Cib)
110 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
20 pF
Peak Collector Current (ICM)
1.5 A
Power Dissipation (PD)
2 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
62.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP705V-CZT4033-CM WafflePack@400 Active 80V,1A,2W Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE
CP705V-CZT4033-CT WafflePack@400 Active 80V,1A,2W Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE
CP705V-CZT4033-CT20 WafflePack@20 Special Order Item 80V,1A,2W Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE
CP705V-CZT4033-WN Wafer Active 80V,1A,2W Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE
CP705V-HCZT4033-CM WafflePack@400 Active 80V,1A,2W Up-Screened Bare Die MIL-PRF-38534 Class H Equivalent,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP705V_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Small Signal Transistor Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPT4033 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

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