CP710-MPSA92
300V,500mA,625mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 20 mA
IB = 2 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 200 V
Test Conditions
IC = 1 mA
Test Conditions
IC = 20 mA
IB = 2 mA
Test Conditions
VCE = 20 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 10 V
IC = 1 mA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 30 mA
Test Conditions
IE = 100 µA
Test Conditions
VEB = 3 V
Test Conditions
VCB = 20 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP710-MPSA92-CT | WafflePack@400 | Discontinued | 300V,500mA,625mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP710.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:WAFER THICKNESS REDUCTION | Process Change Notice |
| Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS | Product EOL Notice |
| Spice Model:Spice Model CP710 | Spice Model |
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