CP710V-2N5416
300V,1A,1W Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
VCB = 280 V
Test Conditions
IC = 50 mA
Test Conditions
IC = 50 mA
RBE = 50 Ω
Test Conditions
VCE = 300 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 250 V
Test Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
VCE = 10 V
IC = 10 mA
f = 5 MHz
Test Conditions
VCE = 10 V
IC = 50 mA
Test Conditions
VEB = 6 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCE = 100 V
tp = 0.4 s
Test Conditions
VCE = 10 V
IC = 5 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP710V-2N5416-CT | WafflePack@400 | Active | 300V,1A,1W Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| CP710V-2N5416_WPD.PDF | Device Datasheet |
| Material Composition:TO-39 | Material Composition |
| Package Detail Document:TO-39 | Package Detail Document |
| Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N5416 | Spice Model |