CP710V-CJD350

300V,500mA,15W Bare die,25.980 X 25.980 mils,Transistor-Bipolar Power (>1A)

Case Type: CHIP,WAFFLE

Base-Emitter On Voltage (VBE(ON))
2 V
Collector-Base Cutoff Current (ICBO)
100 µA
Collector-Base Voltage (VCBO)
300 V
Collector-Emitter Breakdown Voltage (BVCEO)
300 V
Collector-Emitter Cutoff Current (ICEO)
100 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
2.6 V
Collector-Emitter Voltage (VCEO)
300 V
Continuous Collector Current (IC)
500 mA
Current Gain-Bandwidth Product (fT)
10 MHz
DC Current Gain (hFE)
30 — 240
Emitter-Base Cutoff Current (IEBO)
100 µA
Emitter-Base Voltage (VEBO)
3 V
Junction Temperature (Tj)
-65 — 150 °C
Peak Collector Current (ICM)
750 mA
Power Dissipation (PD)
15 W
Power Dissipation (PD)
1.56 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
80.1 °C/W
Thermal Resistance Junction-Case (ΘJC)
8.33 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP710V-CJD350-CT WafflePack@400 Active 300V,500mA,15W Bare die,25.980 X 25.980 mils,Transistor-Bipolar Power (>1A) EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
CP710V-CJD350_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Process Change Notice:CP710V PROCESS Process Change Notice