CP714V-2N5322

75V,2A,10W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A)

Case Type: CHIP,WAFFLE

Base-Emitter On Voltage (VBE(ON))
1.1 V
Collector-Base Cutoff Current (ICBO)
500 nA
Collector-Base Voltage (VCBO)
100 V
Collector-Emitter Breakdown Voltage (BVCEO)
75 V
Collector-Emitter Breakdown Voltage (BVCEV)
100 V
Collector-Emitter Saturation Voltage (VCE(SAT))
700 mV
Collector-Emitter Voltage (VCEV)
100 V
Collector-Emitter Voltage (VCEO)
75 V
Continuous Base Current (IB)
1 A
Continuous Collector Current (IC)
2 A
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
30 — 200
DC Current Gain (hFE)
10
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
6 V
Junction Temperature (Tj)
-65 — 200 °C
Power Dissipation (PD)
10 W
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient (ΘJA)
175 °C/W
Thermal Resistance Junction-Case (ΘJC)
17.5 °C/W
Turn Off Time (toff)
1 µs
Turn On Time (ton)
100 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP714V-2N5322-CT WafflePack@400 Active 75V,2A,10W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) EAR99 8541.29.0040 PBFREE
CP714V-2N5322-WN Wafer Active 75V,2A,10W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) EAR99 8541.29.0040 PBFREE
CP714V-2N5322-WR Wafer Active 75V,2A,10W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CP714V-2N5322_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Process Change Notice:Wafer Diameter Change from 4" Process Change Notice
Spice Model:Spice Model CP714 Spice Model

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