CP714V-MPS750
40V,2A,625mW Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 1 A
VCE = 2 V
Test Conditions
IC = 1 A
IB = 100 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 60 V
Test Conditions
IC = 10 mA
Test Conditions
IC = 1 A
IB = 100 mA
Test Conditions
IC = 2 A
IB = 200 mA
Test Conditions
VCE = 5 V
IC = 50 mA
f = 100 MHz
Test Conditions
VCE = 2 V
IC = 50 mA
Test Conditions
VCE = 2 V
IC = 500 mA
Test Conditions
VCE = 2 V
IC = 1 A
Test Conditions
VCE = 2 V
IC = 2 A
Test Conditions
IE = 10 µA
Test Conditions
VEB = 4 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP714V-MPS750-CM200 | WafflePack@200 | Special Order Item | 40V,2A,625mW Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP714V-MPS750-CT | WafflePack@400 | Active | 40V,2A,625mW Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP714V-MPS750-CT200 | WafflePack@200 | Special Order Item | 40V,2A,625mW Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
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| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| CP714V-MPS750_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model MPS750 | Spice Model |