CP740V-2N5367
40V,300mA,625mW Bare die,22.047 X 22.047 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 2 mA
VCE = 10 V
Test Conditions
IC = 50 mA
IB = 2.5 mA
Test Conditions
IC = 300 mA
IB = 30 mA
Test Conditions
VCB = 40 V
Test Conditions
VCB = 40 V
TA = 100 °C
Test Conditions
IC = 10 mA
Test Conditions
VCE = 40 V
Test Conditions
IC = 50 mA
IB = 2.5 mA
Test Conditions
IC = 300 mA
IB = 30 mA
Test Conditions
VCE = 10 V
IC = 2 mA
Test Conditions
VCE = 10 V
IC = 2 mA
Test Conditions
VCE = 1 V
IC = 50 mA
Test Conditions
VCE = 5 V
IC = 300 mA
Test Conditions
VEB = 4 V
Test Conditions
VCE = 10 V
IC = 2 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP740V-2N5367-CT | WafflePack@400 | Active | 40V,300mA,625mW Bare die,22.047 X 22.047 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP740V-2N5367_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |