CP788X-2N2605
45V,30mA,400mW Bare die,13.700 X 13.700 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 mA
IB = 0.5 mA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 45 V
Test Conditions
IC = 10 mA
Test Conditions
VCE = 45 V
Test Conditions
VCE = 45 V
TA = 170 °C
Test Conditions
IC = 10 mA
IB = 0.5 mA
Test Conditions
VCE = 5 V
IC = 500 µA
f = 30 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 10 µA
TA = -55 °C
Test Conditions
VCE = 5 V
IC = 500 µA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 5 V
Test Conditions
VCB = 5 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 5 V
IC = 1 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
f = 15.7 kHz
RG = 10 kΩ
Test Conditions
VCB = 5 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCB = 5 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCB = 5 V
IC = 1 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP788X-2N2605-CT | WafflePack@400 | Active | 45V,30mA,400mW Bare die,13.700 X 13.700 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP788X-2N2605-WN | Wafer | Active | 45V,30mA,400mW Bare die,13.700 X 13.700 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:TVS Die | Analytical Test Report |
| Analytical Test Report:Wafer Rectifier | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| Analytical Test Report:Wafer/Die | Analytical Test Report |
| CP788X-2N2605_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:CP188 and CP588 replaced by | Process Change Notice |
| Process Change Notice:WAFER THICKNESS REDUCTION | Process Change Notice |
| Product EOL Notice:CP188/588 to CP388X/788X | Product EOL Notice |
| Spice Model:Spice Model CP588 | Spice Model |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development