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CP788X-2N5087

50V,50mA,625mW Bare die,13.700 X 13.700 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Base-Emitter On Voltage (VBE(ON))
850 mV
Collector-Base Breakdown Voltage (BVCBO)
50 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
50 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCEO)
50 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
40 MHz
DC Current Gain (hFE)
250 — 800
DC Current Gain (hFE)
250
DC Current Gain (hFE)
250
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Voltage (VEBO)
3 V
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
2 dB
Noise Figure (NF)
2 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
625 mW
Power Dissipation (PD)
1.5 W
Small Signal Current Gain (hfe)
250 — 900
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
83.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP788X-2N5087-CT WafflePack@400 Active 50V,50mA,625mW Bare die,13.700 X 13.700 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP788X-2N5087-CT20 WafflePack@20 Special Order Item 50V,50mA,625mW Bare die,13.700 X 13.700 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP788X-2N5087_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Small Signal Transistor Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPT5087 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object