CP788X-BCW70
Bare die,13.700 X 13.700 mils,Low Noise Amplifier Transistor
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 10 V
Test Conditions
VCB = 35 V
Test Conditions
IC = 1 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
VCE = 5 V
IC = 500 µA
f = 20 MHz
Test Conditions
VCE = 5 V
IC = 0.1 mA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
IE = 100 µA
Test Conditions
VCE = 5 V
IC = 100 µA
RS = 10 kΩ
f = 15.7 kHz
Test Conditions
VCB = 5 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 1 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP788X-BCW70-CT | WafflePack@400 | Active | Bare die,13.700 X 13.700 mils,Low Noise Amplifier Transistor | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP788X-BCW70_WPD.pdf | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |