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CP341V-CMPT3410

25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Base-Emitter On Voltage (VBE(ON))
900 mV
Base-Emitter Saturation Voltage (VBE(SAT))
1.1 V
Collector-Base Breakdown Voltage (BVCBO)
40 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage (VCBO)
40 V
Collector-Emitter Breakdown Voltage (BVCEO)
25 V
Collector-Emitter Saturation Voltage (VCE(SAT))
50 mV

(25 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
75 mV

(40 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
150 mV

(80 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV

(190 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV

(290 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
450 mV

(360 mV Typical)

Collector-Emitter Voltage (VCEO)
25 V
Continuous Collector Current (IC)
1 A
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
100
DC Current Gain (hFE)
100 — 300
DC Current Gain (hFE)
100
DC Current Gain (hFE)
50
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
6 V
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
10 pF

(6 pF Typical)

Peak Collector Current (ICM)
1.5 A
Power Dissipation (PD)
350 mW
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP341V-CMPT3410-CM WafflePack@400 Active 25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP341V-CMPT3410-CT WafflePack@400 Active 25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE
CP341V-CMPT3410-WN Wafer Active 25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A) EAR99 8541.21.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP341V.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Small Signal Transistor Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPT3410 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

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