CP782X-CMPT7820
60V,1A,350mW Bare die,26.000 X 26.000 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 1 A
VCE = 5 V
Test Conditions
IC = 1 A
IB = 50 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 60 V
Test Conditions
IC = 10 mA
Test Conditions
IC = 100 mA
IB = 1 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
IC = 1 A
IB = 100 mA
Test Conditions
VCE = 10 V
IC = 50 mA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 500 mA
Test Conditions
VCE = 5 V
IC = 1 A
Test Conditions
IE = 100 µA
Test Conditions
VEB = 5 V
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP782X-CMPT7820-CT | WafflePack@400 | Active | 60V,1A,350mW Bare die,26.000 X 26.000 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP782X-CMPT7820_WPD.PDF | Device Datasheet |
| Material Composition:SOT-89 | Material Composition |
| Package Detail Document:SOT-89 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-89 | Process Change Notice |
| Product EOL Notice:All Devices in the SOT-89 | Product EOL Notice |
| Product Reliability Data:SOT-89 Package Reliability | Product Reliability Data |