CP784X-CXT7090L
40V,3A,1.2W Bare die,39.760 X 39.760 mils,Transistor-Bipolar Power (>1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 1 A
IB = 10 mA
(0.8 V Typical)
Test Conditions
IC = 100 µA
Test Conditions
VCB = 30 V
Test Conditions
VCB = 30 V
TA = 100 °C
Test Conditions
IC = 10 mA
Test Conditions
IC = 500 mA
IB = 5 mA
(100 mV Typical)
Test Conditions
IC = 1 A
IB = 10 mA
(175 mV Typical)
Test Conditions
IC = 2 A
IB = 50 mA
(250 mV Typical)
Test Conditions
VCE = 5 V
IC = 50 mA
f = 50 MHz
Test Conditions
VCE = 2 V
IC = 10 mA
Test Conditions
VCE = 2 V
IC = 500 mA
Test Conditions
VCE = 2 V
IC = 1 A
Test Conditions
VCE = 2 V
IC = 2 A
Test Conditions
IE = 100 µA
Test Conditions
VEB = 4 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP784X-CXT7090L-CT | WafflePack@400 | Active | 40V,3A,1.2W Bare die,39.760 X 39.760 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP784X-CXT7090L-WN | Wafer | Active | 40V,3A,1.2W Bare die,39.760 X 39.760 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP784X-CXT7090L_WPD.PDF | Device Datasheet |
| Material Composition:SOT-26 | Material Composition |
| Package Detail Document:SOT-26 | Package Detail Document |
| Product Reliability Data:SOT-26 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-26 | Step File 3D Object |
Product Support
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development