CBRDFSH1-60

1A,60V Surface mount Rectifier-Bridge Schottky

Case Type: BR DFN

Average Forward Current (IO)
1 A
Continuous Reverse Voltage (VR)
60 V
Forward Voltage (VF)
700 mV

(600 mV Typical)

Junction Capacitance (CJ)
250 pF
Junction Temperature (Tj)
-55 — 125 °C
Peak Forward Surge Current (IFSM)
30 A
Peak Repetitive Reverse Voltage (VRRM)
60 V
Reverse Voltage Leakage Current (IR)
200 µA

(10 µA Typical)

RMS Reverse Voltage (VR(RMS))
42 V
Storage Temperature (Tstg)
-55 — 125 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CBRDFSH1-60 BK Box@200 Special Order Item 1A,60V Surface mount Rectifier-Bridge Schottky EAR99 8541.10.0080 PBFREE
CBRDFSH1-60 TR13 Tape & Reel@5,000 Special Order Item 1A,60V Surface mount Rectifier-Bridge Schottky EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Encapsulation Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Terminal Plating Analytical Test Report
CBRDFSH1-40_60_100.PDF Device Datasheet
Material Composition:BR DFN Material Composition
Package Detail Document:BR DFN Package Detail Document
Process Change Notice:CBRDFSH1-60 Process Change Notice
Product Brief:PB CBRDFSH series Product Brief
Product Reliability Data:BR DFN Package Reliability Product Reliability Data
Spice Model:Spice Model CBRDFSH1-60 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development