CDCLD200

27V,200mA Surface mount Diode-Current Limiting Single: High Current

Case Type: DPAK

Junction Temperature (Tj)
-55 — 150 °C
Limiting Voltage (VL)
2 V
Peak Operating Voltage (POV)
27 V
Peak Operating Voltage (POV)
50 V
Power Dissipation (PD)
6.25 W
Power Dissipation (PD)
28.75 W
Regulator Current (IP)
170 — 230 mA

(200 mA Typical)

Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Case (ΘJC)
4 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CDCLD200 BK Box@150 Active 27V,200mA Surface mount Diode-Current Limiting Single: High Current EAR99 8541.10.0050 PBFREE
CDCLD200 TR13 Tape & Reel@2,500 Active 27V,200mA Surface mount Diode-Current Limiting Single: High Current EAR99 8541.10.0050 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Ni added Al Bond Wire Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CDCLD200_SERIES.PDF Device Datasheet
Material Composition:DPAK Material Composition
Package Detail Document:DPAK Package Detail Document
Process Change Notice:DPAK Case Process Change Notice
Product Brief:PB ZTC CLD Product Brief
Product Reliability Data:DPAK Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development