1N4005GPP

1A,600V Through-Hole Rectifier-General Purpose Single

Case Type: DO-41

Average Forward Current (IO)
1 A
Continuous Reverse Voltage (VR)
600 V
Forward Voltage (VF)
1.1 V
Junction Capacitance (CJ)
8 pF
Junction Temperature (Tj)
-65 — 175 °C
Peak Forward Surge Current (IFSM)
30 A
Peak Repetitive Reverse Voltage (VRRM)
600 V
Reverse Recovery Time (trr)
2 µs
Reverse Voltage Leakage Current (IR)
5 µA
Reverse Voltage Leakage Current (IR)
50 µA
RMS Reverse Voltage (VR(RMS))
420 V
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Ambient (ΘJA)
45 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
1N4005GPP BK Box@2,000 Discontinued 1A,600V Through-Hole Rectifier-General Purpose Single EAR99 8541.10.0080 PBFREE
1N4005GPP TR Tape & Reel@5,000 Discontinued 1A,600V Through-Hole Rectifier-General Purpose Single EAR99 8541.10.0080 PBFREE

Resources

1N4001GPP.PDF Device Datasheet
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:INK Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-41 Material Composition
Package Detail Document:DO-41 Package Detail Document
Product EOL Notice:1N4001 Series of 1A rectifiers Product EOL Notice
Product Reliability Data:DO-41 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development