CHD8-06

8A,600V Surface mount Rectifier-Hyperfast <25ns Single

Case Type: DPAK

Average Forward Current (IO)
8 A
Continuous Reverse Voltage (VR)
600 V
Forward Voltage (VF)
2.2 V

(1.9 V Typical)

Junction Capacitance (CJ)
35 pF

(26 pF Typical)

Junction Temperature (Tj)
-65 — 175 °C
Peak Forward Surge Current (IFSM)
70 A
Peak Repetitive Reverse Voltage (VRRM)
600 V
Reverse Recovery Time (trr)
25 ns

(22 ns Typical)

Reverse Voltage Leakage Current (IR)
10 µA
Reverse Voltage Leakage Current (IR)
500 µA
RMS Reverse Voltage (VR(RMS))
420 V
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Lead (ΘJL)
5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CHD8-06 BK Box@150 Active 8A,600V Surface mount Rectifier-Hyperfast <25ns Single EAR99 8541.10.0080 TIN
CHD8-06 TR13 Tape & Reel@2,500 Active 8A,600V Surface mount Rectifier-Hyperfast <25ns Single EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Ni added Al Bond Wire Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CHD8-06.PDF Device Datasheet
Material Composition:DPAK Material Composition
Package Detail Document:DPAK Package Detail Document
Process Change Notice:DPAK Case Process Change Notice
Product Brief:PB HYPERFAST RECTIFIERS Product Brief
Product Reliability Data:DPAK Package Reliability Product Reliability Data
Spice Model:Spice Model CHD8-06 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development