CMR1F-10M

1A,1000V Surface mount Rectifier-Fast Recovery <500ns Single

Case Type: SMA

Average Forward Current (IO)
1 A
Continuous Reverse Voltage (VR)
1000 V
Forward Voltage (VF)
1.3 V
Junction Capacitance (CJ)
35 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
30 A
Peak Repetitive Reverse Voltage (VRRM)
1000 V
Reverse Recovery Time (trr)
500 ns
Reverse Voltage Leakage Current (IR)
5 µA
Reverse Voltage Leakage Current (IR)
200 µA
RMS Reverse Voltage (VR(RMS))
700 V
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Lead (ΘJL)
30 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMR1F-10M BK Box@800 Active 1A,1000V Surface mount Rectifier-Fast Recovery <500ns Single EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Hi-Lead Solder Paste Analytical Test Report
Analytical Test Report:Lead Frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Solder Analytical Test Report
Analytical Test Report:Tin Ingot Analytical Test Report
CMR1F-02M-10M.PDF Device Datasheet
Material Composition:SMA Material Composition
Package Detail Document:SMA TR13 Package Detail Document
Process Change Notice:SMA CASE Process Change Notice
Product Reliability Data:SMA Package Reliability Product Reliability Data

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
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  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development