CMR3U-02M

3A,200V Surface mount Rectifier-Ultra Fast <100ns Single

Case Type: SMB

Average Forward Current (IO)
3 A
Continuous Reverse Voltage (VR)
200 V
Forward Voltage (VF)
1 V
Junction Temperature (Tj)
-65 — 175 °C
Peak Forward Surge Current (IFSM)
100 A
Peak Repetitive Reverse Voltage (VRRM)
200 V
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
5 µA
Reverse Voltage Leakage Current (IR)
500 µA
RMS Reverse Voltage (VR(RMS))
140 V
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Lead (ΘJL)
30 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMR3U-02M BK Box@500 Active 3A,200V Surface mount Rectifier-Ultra Fast <100ns Single EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Solder Analytical Test Report
CMR3U-01M-10M.PDF Device Datasheet
Material Composition:SMB Material Composition
Package Detail Document:SMB Package Detail Document
Process Change Notice:GP & ULTRAFAST RECTIFIERS Process Change Notice
Process Change Notice:SMB CASE Process Change Notice
Product Reliability Data:SMB Package Reliability Product Reliability Data
Spice Model:Spice Model CMR3U-02M Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development