CR16UD-04FP

16A,400V Through-Hole Rectifier-Ultra Fast <100ns Dual: Common Cathode

Case Type: TO-220FP

Average Forward Current (IO)
16 A
Continuous Reverse Voltage (VR)
400 V
Forward Voltage (VF)
1.3 V
Forward Voltage (VF)
1.1 V
Junction Capacitance (CJ)
170 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
125 A
Peak Repetitive Reverse Voltage (VRRM)
400 V
Reverse Recovery Time (trr)
50 ns

(35 ns Typical)

Reverse Voltage Leakage Current (IR)
10 µA
Reverse Voltage Leakage Current (IR)
500 µA
RMS Reverse Voltage (VR(RMS))
280 V
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
30 °C/W
Thermal Resistance Junction-Case (ΘJC)
3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CR16UD-04FP Sleeve@50 Active 16A,400V Through-Hole Rectifier-Ultra Fast <100ns Dual: Common Cathode EAR99 8541.10.0080 PBFREE

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Ni added Al Bond Wire Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Pure Tin Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CR16UD-02FP-08FP.PDF Device Datasheet
Package Detail Document:TO-220FP Package Detail Document
Spice Model:Spice Model CR16UD-04FP Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development