CR6A6GPP

6A,600V Through-Hole Rectifier-General Purpose Single

Case Type: CASE 106

Average Forward Current (IO)
6 A
Continuous Reverse Voltage (VR)
600 V
Forward Voltage (VF)
1 V
Junction Temperature (Tj)
-65 — 175 °C
Peak Forward Surge Current (IFSM)
400 A
Peak Non-Repetitive Rerverse Voltage (VRSM)
720 V
Peak Repetitive Reverse Voltage (VRRM)
600 V
Reverse Voltage Leakage Current (IR)
10 µA
Reverse Voltage Leakage Current (IR)
1 mA
RMS Reverse Voltage (VR(RMS))
420 V
Storage Temperature (Tstg)
-65 — 175 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CR6A6GPP BK Box@250 Active 6A,600V Through-Hole Rectifier-General Purpose Single EAR99 8541.10.0080 PBFREE
CR6A6GPP TR Tape & Reel@800 Active 6A,600V Through-Hole Rectifier-General Purpose Single EAR99 8541.10.0080 PBFREE

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:INK Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CR6A4GPP.PDF Device Datasheet
Material Composition:CASE 106 Material Composition
Package Detail Document:CASE 106 Package Detail Document
Process Change Notice:AXIAL LEAD PRODUCTS Process Change Notice
Product Reliability Data:CASE 106 Package Reliability Product Reliability Data
Spice Model:Spice Model CR6A6GPP Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
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  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development