CRU24715-600

600V Through-Hole Rectifier-Hyperfast <35ns

Case Type: TO-247

DC Blocking Voltage (VDC)
600 V
Diode Forward Current (IF(AV))
15 A
Diode Forward Current (IF(AV))
30 A
Forward Voltage (VF)
1.45 V
Forward Voltage (VF)
2.3 V

(1.8 V Typical)

Junction Temperature (Tj)
-55 — 150 °C
Peak Forward Surge Current (IFSM)
140 A
Peak Repetitive Forward Current (IFRM)
30 A
Peak Repetitive Reverse Voltage (VRRM)
600 V
Power Dissipation (PD)
50 W
Reverse Recovery Time (trr)
30 ns
Reverse Recovery Time (trr)
40 ns
Reverse Voltage Leakage Current (IR)
500 µA
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-55 — 150 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CRU24715-600 SL Sleeve@30 Active 600V Through-Hole Rectifier-Hyperfast <35ns EAR99 8541.10.0080 PBFREE

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Wire Analytical Test Report
Material Composition:TO-247 Material Composition
Package Detail Document:TO-247 Package Detail Document
Product Brief:600V HyperFast Rectifiers Product Brief
Product Reliability Data:TO-247 Package Reliability Product Reliability Data
Spice Model:CRU24715-600 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development