CZR1-04C

2A,400V Surface mount Rectifier-General Purpose Dual: Common Cathode

Case Type: SOT-223

Average Forward Current (IO)
2 A
Continuous Reverse Voltage (VR)
400 V
Forward Voltage (VF)
1.2 V
Forward Voltage (VF)
1.5 V
Junction Capacitance (CJ)
26 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
10 A
Peak Repetitive Reverse Voltage (VRRM)
400 V
Power Dissipation (PD)
2 W
Reverse Breakdown Voltage (BVR)
400 V
Reverse Recovery Time (trr)
1 µs
Reverse Voltage Leakage Current (IR)
1 µA
Reverse Voltage Leakage Current (IR)
50 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
62.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CZR1-04C BK Box@350 Active 2A,400V Surface mount Rectifier-General Purpose Dual: Common Cathode EAR99 8541.10.0080 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CZR1-04C.PDF Device Datasheet
Material Composition:SOT-223 Material Composition
Package Detail Document:SOT-223 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-223 Process Change Notice
Process Change Notice:CPD69 Wafer Thickness Increase Process Change Notice
Product EOL Notice:All devices in SOT-223 Case Product EOL Notice
Product Reliability Data:SOT-223 Package Reliability Product Reliability Data
Step File 3D Object:SOT-223 Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development