UF4005

1A,600V Through-Hole Rectifier-Ultra Fast <100ns Single

Case Type: DO-41

Average Forward Current (IO)
1 A
Continuous Reverse Voltage (VR)
600 V
Forward Voltage (VF)
1.7 V
Junction Capacitance (CJ)
10 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
30 A
Peak Repetitive Reverse Voltage (VRRM)
600 V
Reverse Recovery Time (trr)
75 ns
Reverse Voltage Leakage Current (IR)
10 µA
Reverse Voltage Leakage Current (IR)
100 µA
RMS Reverse Voltage (VR(RMS))
420 V
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
50 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
UF4005 BK Box@2,000 Discontinued 1A,600V Through-Hole Rectifier-Ultra Fast <100ns Single EAR99 8541.10.0080 PBFREE
UF4005 TR Tape & Reel@5,000 Discontinued 1A,600V Through-Hole Rectifier-Ultra Fast <100ns Single EAR99 8541.10.0080 PBFREE

Resources

Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:INK Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-41 Material Composition
Package Detail Document:DO-41 Package Detail Document
Product EOL Notice:UF4001 Series Product EOL Notice
Product Reliability Data:DO-41 Package Reliability Product Reliability Data
UF4001-UF4007.PDF Device Datasheet

AEM stands ready to assist with your latest design endeavors as your trusted partner.

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development