CFSH2-3L

200mA,30V Surface mount Diode-Schottky (<1A) Single

Case Type: SOD-882L

Average Forward Current (IO)
200 mA
Forward Voltage (VF)
190 mV

(115 mV Typical)

Forward Voltage (VF)
250 mV

(175 mV Typical)

Forward Voltage (VF)
300 mV

(240 mV Typical)

Forward Voltage (VF)
400 mV

(350 mV Typical)

Forward Voltage (VF)
480 mV

(420 mV Typical)

Junction Capacitance (CJ)
25 pF

(11 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
3 A
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
100 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Voltage Leakage Current (IR)
10 µA

(4 µA Typical)

Reverse Voltage Leakage Current (IR)
50 µA

(10 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
1250 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CFSH2-3L BK Box@5,000 Active 200mA,30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 TIN
CFSH2-3L TR Tape & Reel@8,000 Active 200mA,30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Ni/Pd/Au plated leadframe Analytical Test Report
CFSH2-3L.PDF Device Datasheet
Material Composition:SOD-882L Material Composition
Package Detail Document:SOD-882L Package Detail Document
Process Change Notice:CFSH01-30 Process Change Notice
Product Reliability Data:SOD-882L Package Reliability Product Reliability Data
Spice Model:Spice Model CFSH2-3L Spice Model

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  • Supply management (Customer portals)
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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development