CMASH-4

200mA,40V Surface mount Diode-Schottky (<1A) Single

Case Type: SOD-923

Average Forward Current (IO)
200 mA
Forward Voltage (VF)
380 mV

(350 mV Typical)

Forward Voltage (VF)
650 mV

(550 mV Typical)

Forward Voltage (VF)
1 V

(0.77 V Typical)

Junction Capacitance (CJ)
5 pF
Junction Temperature (Tj)
-65 — 125 °C
Peak Forward Surge Current (IFSM)
600 mA
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
100 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
200 nA

(25 nA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
1000 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMASH-4 BK Box@5,000 Active 200mA,40V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMASH-4.PDF Device Datasheet
Material Composition:SOD-923 Material Composition
Package Detail Document:SOD-923 Package Detail Document
Process Change Notice:SOD-923 CASE Process Change Notice
Product Reliability Data:SOD-923 Package Reliability Product Reliability Data
Spice Model:Spice Model CMASH-4 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development