CMDSH-3

100mA,30V Surface mount Diode-Schottky (<1A) Single

Case Type: SOD-323

Average Forward Current (IO)
100 mA
Forward Voltage (VF)
290 mV
Forward Voltage (VF)
370 mV
Forward Voltage (VF)
550 mV

(440 mV Typical)

Forward Voltage (VF)
800 mV

(510 mV Typical)

Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
750 mA
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
250 mW
Power Dissipation (PD)
833 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W
Thermal Resistance Junction-Lead (ΘJL)
150 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMDSH-3G BK Box@5,000 Discontinued 100mA,30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 PBFREE
CMDSH-3G TR Tape & Reel@3,000 Discontinued 100mA,30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMDSH-3.PDF Device Datasheet
Material Composition:SOD-323 Material Composition
Package Detail Document:SOD-323 Package Detail Document
Product EOL Notice:All P/Ns in the SOD-323 case Product EOL Notice
Product EOL Notice:CMDSH-3G Product EOL Notice
Product Reliability Data:SOD-323 Package Reliability Product Reliability Data
Spice Model:Spice Model CMDSH-3 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development