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CMHSH-3

30V Surface mount Diode-Schottky (<1A) Single

Case Type: SOD-123

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Technical Specifications

Similar Products with Selected Specifications
Continuous Forward Current (IF)
200 mA
Forward Voltage (VF)
240 mV
Forward Voltage (VF)
320 mV
Forward Voltage (VF)
400 mV
Forward Voltage (VF)
500 mV
Forward Voltage (VF)
1 V
Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
600 mA
Peak Repetitive Forward Current (IFRM)
300 mA
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
400 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
7 ns
Reverse Voltage Leakage Current (IR)
2 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
312.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMHSH-3 BK Box@3,500 Active 30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 TIN
CMHSH-3 TR Tape & Reel@3,000 Active 30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 LEAD or TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
CMHSH-3.PDF Device Datasheet
Material Composition:SOD-123 Material Composition
Package Detail Document:SOD-123 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOD-123 Package Reliability Product Reliability Data
Spice Model:Spice Model CMHSH-3 Spice Model

Product Support

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  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

Design Support

Contact Design Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development