CMHSH5-2L
500mA,20V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Case Type: SOD-123
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 100 mA
(250 mV Typical)
Test Conditions
IF = 100 mA
TA = 100 °C
(158 mV Typical)
Test Conditions
IF = 500 mA
(355 mV Typical)
Test Conditions
IF = 500 mA
TA = 100 °C
(301 mV Typical)
Test Conditions
VR = 4 V
f = 1 MHz
Test Conditions
f = 1 MHz
Test Conditions
IR = 250 µA
Test Conditions
VR = 10 V
(43 µA Typical)
Test Conditions
VR = 10 V
TA = 100 °C
(4.77 mA Typical)
Test Conditions
VR = 20 V
(70.7 µA Typical)
Test Conditions
VR = 20 V
TA = 100 °C
(7.16 mA Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMHSH5-2L BK | Box@3,500 | Active | 500mA,20V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF | EAR99 | 8541.10.0070 | PBFREE | |
| CMHSH5-2L TR | Tape & Reel@3,000 | Active | 500mA,20V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF | EAR99 | 8541.10.0070 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| CMHSH5-2L.PDF | Device Datasheet |
| Material Composition:SOD-123 | Material Composition |
| Package Detail Document:SOD-123 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:Tin Wafer Backside Metal | Process Change Notice |
| Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |
| Spice Model:P-Spice Model CMHSH5-2L | Spice Model |
| Spice Model:Spice Model CMHSH5-2L | Spice Model |
Product Support
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development