Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 500 mA
(460 mV Typical)
Test Conditions
IF = 500 mA
TA = 100 °C
(411 mV Typical)
Test Conditions
IF = 1 A
(567 mV Typical)
Test Conditions
IF = 1 A
TA = 100 °C
(541 mV Typical)
Test Conditions
VR = 4 V
f = 1 kHz
Test Conditions
f = 1 MHz
Test Conditions
IR = 10 µA
Test Conditions
VR = 20 V
(0.7 µA Typical)
Test Conditions
VR = 20 V
TA = 100 °C
(0.2 mA Typical)
Test Conditions
VR = 40 V
(1.7 µA Typical)
Test Conditions
VR = 40 V
TA = 100 °C
(0.38 mA Typical)
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CMHSH5-4 BK | Box@3,500 | Active | 500mA,40V Surface mount Diode-Schottky (<1A) Single | EAR99 | 8541.10.0070 | PBFREE |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Copper Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
CMHSH5-4.PDF | Device Datasheet |
Material Composition:SOD-123 | Material Composition |
Package Detail Document:SOD-123 | Package Detail Document |
Process Change Notice:Copper Wire Bonding | Process Change Notice |
Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |
Spice Model:P-Spice Model CMHSH5-4 | Spice Model |
Spice Model:Spice Model CMHSH5-4 | Spice Model |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development