CMHSH5-4

500mA,40V Surface mount Diode-Schottky (<1A) Single

Case Type: SOD-123

Average Forward Current (IO)
500 mA
Continuous Reverse Voltage (VR)
40 V
Forward Voltage (VF)
510 mV

(460 mV Typical)

Forward Voltage (VF)
460 mV

(411 mV Typical)

Forward Voltage (VF)
620 mV

(567 mV Typical)

Forward Voltage (VF)
610 mV

(541 mV Typical)

Junction Capacitance (CJ)
50 pF
Junction Capacitance (CJ)
147 pF
Junction Temperature (Tj)
-65 — 125 °C
Peak Forward Surge Current (IFSM)
5.5 A
Peak Repetitive Forward Current (IFRM)
1 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Peak Working Reverse Voltage (VRWM)
40 V
Power Dissipation (PD)
400 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
10 µA

(0.7 µA Typical)

Reverse Voltage Leakage Current (IR)
5 mA

(0.2 mA Typical)

Reverse Voltage Leakage Current (IR)
20 µA

(1.7 µA Typical)

Reverse Voltage Leakage Current (IR)
13 mA

(0.38 mA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
250 °C/W
Thermal Resistance Junction-Lead (ΘJL)
118 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMHSH5-4 BK Box@3,500 Active 500mA,40V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
CMHSH5-4.PDF Device Datasheet
Material Composition:SOD-123 Material Composition
Package Detail Document:SOD-123 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOD-123 Package Reliability Product Reliability Data
Spice Model:P-Spice Model CMHSH5-4 Spice Model
Spice Model:Spice Model CMHSH5-4 Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development