CMKD6263

70V Surface mount Diode-Schottky (<1A) Triple: High Voltage

Case Type: SOT-363

Continuous Forward Current (IF)
15 mA
Forward Voltage (VF)
410 mV

(395 mV Typical)

Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 125 °C
Peak Forward Surge Current (IFSM)
50 mA
Peak Repetitive Reverse Voltage (VRRM)
70 V
Power Dissipation (PD)
225 mW
Reverse Breakdown Voltage (BVR)
70 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
200 nA

(10 nA Typical)

Storage Temperature (Tstg)
-65 — 125 °C
Thermal Resistance Junction-Ambient (ΘJA)
556 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMKD6263 BK Box@5,000 Active 70V Surface mount Diode-Schottky (<1A) Triple: High Voltage EAR99 8541.10.0070 PBFREE
CMKD6263 TR Tape & Reel@3,000 Active 70V Surface mount Diode-Schottky (<1A) Triple: High Voltage EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMKD6263.PDF Device Datasheet
Material Composition:SOT-363 Material Composition
Package Detail Document:SOT-363 Package Detail Document
Process Change Notice:CMKD6263 Process Change Notice
Product Reliability Data:SOT-363 Package Reliability Product Reliability Data
Spice Model:I-Spice Model CMKD6263 Spice Model
Spice Model:P-Spice Model CMKD6263 Spice Model
Step File 3D Object:SOT-363 (SC-88) Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development