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CMKSH-3DO

30V Surface mount Diode-Schottky (<1A) Dual: Opposing Polarity

Case Type: SOT-363

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Technical Specifications

Similar Products with Selected Specifications
Continuous Forward Current (IF)
100 mA
Forward Voltage (VF)
330 mV
Forward Voltage (VF)
450 mV
Forward Voltage (VF)
1 V

(0.51 V Typical)

Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
500 nA
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMKSH-3DO BK Box@5,000 Active 30V Surface mount Diode-Schottky (<1A) Dual: Opposing Polarity EAR99 8541.10.0070 PBFREE
CMKSH-3DO TR Tape & Reel@3,000 Active 30V Surface mount Diode-Schottky (<1A) Dual: Opposing Polarity EAR99 8541.10.0070 TIN

Resources

Item Type
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMKSH-3DO.PDF Device Datasheet
Material Composition:SOT-363 Material Composition
Package Detail Document:SOT-363 Package Detail Document
Product Reliability Data:SOT-363 Package Reliability Product Reliability Data
Spice Model:Spice Model CMKSH-3DO Spice Model
Step File 3D Object:SOT-363 (SC-88) Step File 3D Object

Product Support

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Design Support

Contact Design Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development