CMLSH2-4LC
40V Surface mount Diode-Schottky (<1A) Dual Pair: Low VF: Common Cathode
Case Type: SOT-563
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 100 µA
(240 mV Typical)
Test Conditions
IF = 500 µA
(290 mV Typical)
Test Conditions
IF = 1 mA
(310 mV Typical)
Test Conditions
IF = 50 mA
(540 mV Typical)
Test Conditions
IF = 100 mA
(670 mV Typical)
Test Conditions
VR = 1 V
f = 1 MHz
Test Conditions
IR = 100 µA
(55 V Typical)
Test Conditions
IF = 10 mA
IR = 10 mA
RL = 100 Ω
Irr = 1 mA
Test Conditions
VR = 25 V
(100 nA Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMLSH2-4LC TR | Tape & Reel@3,000 | Active | 40V Surface mount Diode-Schottky (<1A) Dual Pair: Low VF: Common Cathode | EAR99 | 8541.10.0070 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLSH2-4LC.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLSH2-4LC | Spice Model |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
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- Custom electrical curves
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development