Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 2 mA
(290 mV Typical)
Test Conditions
IF = 15 mA
(370 mV Typical)
Test Conditions
IF = 100 mA
(510 mV Typical)
Test Conditions
IF = 200 mA
(0.65 V Typical)
Test Conditions
VR = 1 V
f = 1 MHz
Test Conditions
IR = 100 µA
(50 V Typical)
Test Conditions
IF = 10 mA
IR = 10 mA
RL = 100 Ω
Irr = 1 mA
Test Conditions
VR = 25 V
(90 nA Typical)
Test Conditions
VR = 25 V
TA = 100 °C
(25 µA Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMOSH-4E BK | Box@5,000 | Active | 40V Surface mount Diode-Schottky (<1A) Single | EAR99 | 8541.10.0070 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMOSH-4E.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOD-523 | Process Change Notice |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMOSH-4E | Spice Model |
Product Support
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development