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CMPSH-3

30V Surface mount Diode-Schottky (<1A) Single

Case Type: SOT-23

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Technical Specifications

Similar Products with Selected Specifications
Continuous Forward Current (IF)
100 mA
Forward Voltage (VF)
330 mV

(290 mV Typical)

Forward Voltage (VF)
450 mV

(370 mV Typical)

Forward Voltage (VF)
1 V

(0.51 V Typical)

Junction Capacitance (CJ)
20 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
750 mA
Peak Repetitive Forward Current (IFRM)
350 mA
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
500 nA

(90 nA Typical)

Reverse Voltage Leakage Current (IR)
100 µA

(25 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPSH-3 BK Box@3,500 Active 30V Surface mount Diode-Schottky (<1A) Single EAR99 8541.10.0070 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPSH-3-A-C-S.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:Tin Wafer Backside Metal Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPSH-3 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

Product Support

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Design Support

Contact Design Support

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  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development