CMPSH-3CE

40V Surface mount Diode-Schottky (<1A) Dual: Common Cathode

Case Type: SOT-23

Continuous Forward Current (IF)
200 mA
Forward Voltage (VF)
330 mV

(290 mV Typical)

Forward Voltage (VF)
420 mV

(370 mV Typical)

Forward Voltage (VF)
800 mV

(510 mV Typical)

Forward Voltage (VF)
1 V

(0.65 V Typical)

Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
750 mA
Peak Repetitive Forward Current (IFRM)
350 mA
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
40 V

(50 V Typical)

Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
500 nA

(90 nA Typical)

Reverse Voltage Leakage Current (IR)
100 µA

(25 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPSH-3CE BK Box@3,500 Active 40V Surface mount Diode-Schottky (<1A) Dual: Common Cathode EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPSH_3_E_SERIES.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPSH-3CE Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development