CMPSH05-4

40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF

Case Type: SOT-23

Continuous Forward Current (IF)
500 mA
Forward Voltage (VF)
130 mV
Forward Voltage (VF)
210 mV
Forward Voltage (VF)
270 mV
Forward Voltage (VF)
350 mV
Forward Voltage (VF)
470 mV
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
10 A
Peak Repetitive Forward Current (IFRM)
3.5 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
30 µA
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPSH05-4 BK Box@3,500 Active 40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF EAR99 8541.10.0070 TIN
CMPSH05-4 TR Tape & Reel@3,000 Active 40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF EAR99 8541.10.0070 TIN
CMPSH05-4 TR13 Tape & Reel@10,000 Active 40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPSH05-4.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPSH05-4 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
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  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development