CMPSH1-4S

1.75A Surface mount Rectifier-Schottky (>=1A) Single

Case Type: SOT-23

Average Forward Current (IO)
1.75 A
Continuous Forward Current (IF)
1 A
Continuous Reverse Voltage (VR)
40 V
Forward Voltage (VF)
390 mV

(347 mV Typical)

Forward Voltage (VF)
480 mV

(418 mV Typical)

Forward Voltage (VF)
550 mV

(471 mV Typical)

Forward Voltage (VF)
620 mV

(551 mV Typical)

Forward Voltage (VF)
420 mV
Junction Capacitance (CJ)
25 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
12 A
Peak Fwd Surge Current tp=1.0s (IFSM)
5.2 A
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Recovery Time (trr)
12 ns
Reverse Voltage Leakage Current (IR)
100 µA

(2 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPSH1-4S BK Box@3,500 Active 1.75A Surface mount Rectifier-Schottky (>=1A) Single EAR99 8541.10.0080 PBFREE
CMPSH1-4S TR Tape & Reel@3,000 Active 1.75A Surface mount Rectifier-Schottky (>=1A) Single EAR99 8541.10.0080 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPSH1-4S.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Step File 3D Object:SOT-23 Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
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  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development