CMSH3-40

3A,40V Surface mount Rectifier-Schottky (>=1A) Single

Case Type: SMC

Average Forward Current (IO)
3 A
Continuous Reverse Voltage (VR)
40 V
Forward Voltage (VF)
500 mV

(470 mV Typical)

Junction Capacitance (CJ)
510 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
150 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Reverse Voltage Leakage Current (IR)
500 µA
Reverse Voltage Leakage Current (IR)
20 mA
RMS Reverse Voltage (VR(RMS))
28 V
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Lead (ΘJL)
10 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMSH3-40 BK Box@200 Active 3A,40V Surface mount Rectifier-Schottky (>=1A) Single EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Solder Analytical Test Report
CMSH3-20.PDF Device Datasheet
Material Composition:SMC Material Composition
Package Detail Document:SMC Package Detail Document
Process Change Notice:SMC CASE Process Change Notice
Product Reliability Data:SMC Package Reliability Product Reliability Data
Spice Model:I-Spice Model CMSH3-40 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development