CMSSH-3C

100mA,30V Surface mount Diode-Schottky (<1A) Dual: Common Cathode

Case Type: SOT-323

Average Forward Current (IO)
100 mA
Forward Voltage (VF)
330 mV

(290 mV Typical)

Forward Voltage (VF)
450 mV

(370 mV Typical)

Forward Voltage (VF)
1 V

(0.51 V Typical)

Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
750 mA
Peak Repetitive Forward Current (IFRM)
200 mA
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
275 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
500 nA

(90 nA Typical)

Reverse Voltage Leakage Current (IR)
100 µA

(25 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
455 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMSSH-3C BK Box@5,000 Active 100mA,30V Surface mount Diode-Schottky (<1A) Dual: Common Cathode EAR99 8541.10.0070 TIN
CMSSH-3C TR Tape & Reel@3,000 Active 100mA,30V Surface mount Diode-Schottky (<1A) Dual: Common Cathode EAR99 8541.10.0070 LEAD or TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMSSH3_3A_3C_3S.PDF Device Datasheet
Material Composition:SOT-323 Material Composition
Package Detail Document:SOT-323 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:Tin Wafer Backside Metal Process Change Notice
Product Reliability Data:SOT-323 Package Reliability Product Reliability Data
Spice Model:Spice Model CMSSH-3C Spice Model
Step File 3D Object:SOT-323 (SC-70) Step File 3D Object

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development