CMUSH2-4L

200mA,40V Surface mount Diode-Schottky (<1A) Single: Low VF

Case Type: SOT-523

Average Forward Current (IO)
200 mA
Forward Voltage (VF)
325 mV

(240 mV Typical)

Forward Voltage (VF)
400 mV

(350 mV Typical)

Forward Voltage (VF)
500 mV

(420 mV Typical)

Junction Capacitance (CJ)
10 pF

(8.5 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
350 mA
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
40 V

(53 V Typical)

Reverse Recovery Time (trr)
5 ns

(4 ns Typical)

Reverse Voltage Leakage Current (IR)
50 µA

(11 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMUSH2-4L BK Box@5,000 Discontinued 200mA,40V Surface mount Diode-Schottky (<1A) Single: Low VF EAR99 8541.10.0070 PBFREE
CMUSH2-4L TR Tape & Reel@3,000 Discontinued 200mA,40V Surface mount Diode-Schottky (<1A) Single: Low VF EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMUSH2-4L.PDF Device Datasheet
Material Composition:SOT-523 Material Composition
Package Detail Document:SOT-523 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-523 Process Change Notice
Product EOL Notice:CMUSH2-4 series Product EOL Notice
Product Reliability Data:SOT-523 Package Reliability Product Reliability Data
Spice Model:I-Spice Model CMUSH2-4L Spice Model
Step File 3D Object:SOT-523 (SC-89) Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
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  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development